ESD8351, SZESD8351

www.onsemi.com

7

PACKAGE DIMENSIONS

X3DFN2, 0.62x0.32, 0.355P, (0201)

CASE 152AF

ISSUE A

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

A B

E

D

BOTTOM VIEW

b

e

2X

L2

2X

TOP VIEW

2X

A

A1

0.05 C

0.05 C

C

SEATING

PLANE

SIDE VIEW

DIM

MIN

MAX

MILLIMETERS

A

0.25

0.33

A1

−−−

0.05

b

0.22

0.28

e

0.355 BSC

L2

0.17

0.23

MOUNTING FOOTPRINT*

DIMENSIONS: MILLIMETERS

0.74

1

0.30

0.31

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

2

1

See Application Note AND8398/D for more mounting details

A

M

0.05

B

C

A

M

0.05

B

C

2X

2X

RECOMMENDED

PIN 1

INDICATOR

(OPTIONAL)

D

0.58

0.66

E

0.28

0.36