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LV52207AXA Datasheet(PDF) 4 Page - ON Semiconductor |
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LV52207AXA Datasheet(HTML) 4 Page - ON Semiconductor |
4 / 18 page LV52207AXA www.onsemi.com 4 Package Dimensions unit : mm LV52207AXA is as follows. WLCSP9, 1.31x1.31 CASE 567HX ISSUE B SEATING PLANE 0.05 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO THE SPHERICAL CROWNS OF THE SOLDER BALLS. 2X DIM A MIN MAX MILLIMETERS A1 D 1.31 BSC E b 0.21 0.31 e 0.40 BSC 0.625 E D A B PIN A1 REFERENCE A 0.05 B C 0.03 C 0.08 C 9X b 12 3 C B A 0.10 C A A1 C 0.16 0.26 1.31 BSC 0.40 0.20 9X DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* 0.05 C 2X TOP VIEW SIDE VIEW BOTTOM VIEW NOTE 3 e RECOMMENDED A1 PACKAGE OUTLINE e PITCH 0.40 PITCH |
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