NCP6133

http://onsemi.com

6

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL INFORMATION

Pin Symbol

COMP, COMPA

−0.3 V

CSCOMP, CSCOMPA

−0.3 V

VSN

GND + 300 mV

GND – 300 mV

DIFFOUT, DIFFOUTA

−0.3 V

VR_RDY, VR_RDYA

−0.3 V

VCC

6.5 V

−0.3 V

ROSC

−0.3 V

IOUT, IOUTA Output

2.0 V

−0.3 V

VRMP

+25 V

−0.3 V

All Other Pins

−0.3 V

*All signals referenced to GND unless noted otherwise.

THERMAL INFORMATION

Description

Symbol

Typ

Unit

Thermal Characteristic − QFN Package, (Note 1)

68

°C/W

Operating Junction Temperature Range, (Note 2)

−10 to 125

°C

Operating Ambient Temperature Range

−10 to 100

°C

Maximum Storage Temperature Range

−40 to +150

°C

Moisture Sensitivity Level − QFN Package

MSL

1

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

*The maximum package power dissipation must be observed.

1. JESD 51−5 (1S2P Direct−Attach Method) with 0 LFM

2. JESD 51−7 (1S2P Direct−Attach Method) with 0 LFM

Parameter

Test Conditions

Min

Typ

Max

Unit

ERROR AMPLIFIER

Input Bias Current

@ 1.3 V

−400

400

nA

Open Loop DC Gain

80

dB

Open Loop Unity Gain Bandwidth

50

MHz

Slew Rate

DC Load = 10 k to GND

20

V/ms

Maximum Output Voltage

3.5

−

−

V

Minimum Output Voltage

−

−

1

V

DIFFERENTIAL SUMMING AMPLIFIER

Input Bias Current

VSP, VSPA ,VSN, VSNA = 1.3 V

−400

−

400

nA

VSP Input Voltage Range

−0.3

−

3.0

V

VSN Input Voltage Range

−0.3

−

0.3

V

3. Guaranteed by design or characterization data, not in production test.