NL17SG125

http://onsemi.com

8

PACKAGE DIMENSIONS

SOT−953

CASE 527AE

ISSUE E

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

E

D

C

A

12 3

4

5

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD

FINISH. MINIMUM LEAD THICKNESS IS THE

MINIMUM THICKNESS OF THE BASE MATERIAL.

4. DIMENSIONS D AND E DO NOT INCLUDE MOLD

FLASH, PROTRUSIONS, OR GATE BURRS.

DIM

MIN

NOM

MAX

MILLIMETERS

A

0.34

0.37

0.40

b

0.10

0.15

0.20

C

0.07

0.12

0.17

D

0.95

1.00

1.05

E

0.75

0.80

0.85

e

0.35 BSC

L

0.95

1.00

1.05

X

Y

PIN ONE

INDICATOR

b

5X

X

0.08

Y

L

5X

L3

L2

e

5X

5X

L2

0.05

0.10

0.15

L3

−−−

−−−

0.15

0.175 REF

TOP VIEW

SIDE VIEW

BOTTOM VIEW

1.20

DIMENSIONS: MILLIMETERS

0.20

5X

1

PACKAGE

OUTLINE

0.35

PITCH

0.35

5X