NCP3231A

www.onsemi.com

4

Figure 2. Typical Application Circuit

FB

EN

VIN

BST

VSWH

VSW

PGND

COMP

OTS

PG

VB

SS

NCP3231A

VIN

VOUT

VPG

ISET

VCC

AGND

Rating

Symbol

Value

Unit

Power Supply to GND

VIN, VCC

20.5

−0.3

V

VSW to GND

VSWH, VSW

26

−0.6 (DC)

+35 (t < 50 ns)

−5 (t < 100 ns)

V

BST to GND

BST

30 (DC)

−0.6 (DC)

+40 (t < 50 ns)

V

All other pins

6.0

−0.3

V

Operating Ambient Temperature Range (Note 1)

−40 to +90

°C

Operating Junction Temperature Range (Note 1)

−40 to +150

°C

Maximum Junction Temperature

+150

°C

Storage Temperature Range

−55 to +150

°C

Electrostatic Discharge − Human Body Model

HBM

1.0

kV

Electrostatic Discharge − Charge Device Model

CDM

2.0

kV

THERMAL INFORMATION

HS FET Junction-to-Case Thermal Resistance (Note 2)

1.3

°C/W

LS FET Junction-to-Case Thermal Resistance (Note 2)

0.6

°C/W

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. The maximum package power dissipation limit must not be exceeded.

P

T

a close description can be found in the ANSI SEMI standard G30−88.