NCP1124, NCP1126, NCP1129

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4

Rating

Symbol

Value

Unit

Drain Input Voltage (Referenced to Source Terminal)

NCP112x

−0.3 to 650

V

Drain Maximum Pulsed Current

NCP1129

(10

NCP1126

NCP1124

27

11

7

A

Single Pulse Avalanche Energy

NCP1126, NCP1129

NCP1124

96

60

mJ

Supply Input Voltage

−0.3 to 35

V

Current Sense Input Voltage

−0.3 to 10

V

Feedback Input Voltage

−0.3 to 10

V

Operating Junction Temperature

−40 to 150

_C

Storage Temperature Range

–60 to 150

_C

1.5

W

Thermal Resistance, Junction to Ambient 2 Oz Cu Printed Circuit Copper Clad

Low Conductivity (Note 6)

High Conductivity (Note 7)

128

78

_C/W

ESD Capability (Note 8)

Human Body Model ESD Capability per JEDEC JESD22−A114F.

Machine Model ESD Capability per JEDEC JESD22−A115C.

Charged−Device Model ESD Capability per JEDEC JESD22−C101E.

2000

200

500

V

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

5. This device contains Latch−Up protection and exceeds

±100 mA per JEDEC Standard JESD78.

spreading area. As specified for a JEDEC 51 low conductivity test PCB. Test conditions were under natural convection of zero air flow.

spreading area. As specified for a JEDEC 51 high conductivity test PCB. Test conditions were under natural convection of zero air flow.

8. The Drain pins (5 and 6), are rated to the maximum voltage of the device, or 650 V.