DTO25

www.vishay.com

Vishay Sfernice

Revision: 23-Sep-15

1

Document Number: 51054

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Surface Mounted Power Resistor Thick Film Technology

FEATURES

• AEC-Q200 qualified

• 25 W at 25 °C case temperature

• Surface mounted resistor - TO-252 (DPAK) style

package

• Wide resistance range: 0.016

Ω to 700 kΩ

• Non inductive

• Resistor isolated from metal tab

• Solder reflow secure at 270 °C / 10 s, MSL = 1

• Material categorization: for definitions of compliance

Notes

• For the assembly, we recommend the lead (Pb)-free thermal profile as per J-STD-020C.

• Power dissipation is 3.2 W at an ambient temperature of 25 °C when mounted on a double sided copper board using FR4 HTG, 70 μm of

copper, 39 mm x 30 mm x 1.6 mm, with thermal vias.

• For other information about dissipation, see the Application Note 52027: “Thermal Management on SMD Thick Film Resistors (D2TO20,

D2TO35, DTO25)”.

DIMENSIONS in millimeters

STANDARD ELECTRICAL SPECIFICATIONS

MODEL

SIZE

RESISTANCE

RANGE

Ω

RATED POWER

W

LIMITING ELEMENT

VOLTAGE

V

TOLERANCE

± %

TEMPERATURE

COEFFICIENT

± ppm/°C

CRITICAL

RESISTANCE

Ω

DTO25

TO-252 (DPAK)

0.016 to 700K

25

200

1, 2, 5, 10

150

1.6K

8.2

2.8

0.8

6.35

5.08

7.87

2.54

1.65

1.65

1.6

0.6

1.4

0.8

10°

2.54

Footprint recommendation for

solderable contact area:

Tolerance: ± 0.3 mm

MECHANICAL SPECIFICATIONS

Mechanical Protection

Molded

Resistive Element

Thick film

Substrate

Alumina

Connections

Tinned copper, Ni under layer

Weight

2 g max.

ENVIRONMENTAL SPECIFICATIONS

Temperature Range

-55 °C to +150 °C

Climatic Category

55 / 150 / 56

Flammability

IEC 60695-11-5

2 applications 30 s

separated by 60 s

ELECTRICAL SPECIFICATIONS

Tolerances

From 0.016

Ω to 0.047 Ω:

± 5 % and ± 10 %

> 0.047

Ω to 0.1 Ω:

± 2 % to ± 10 %

≥ 0.11 Ω: ± 1 % to ± 10 %

Power Rating and Thermal

Resistance

25 W at +25 °C case

Temperature Coefficient

See Special Feature table

± 150 ppm/°C

Dielectric Strength

(between terminals and board)

Insulation Resistance

Inductance

≤ 0.1 μH

DIMENSIONS

Standard Package

TO-252 style (DPAK)