NUP4107UPMU

http://onsemi.com

3

PACKAGE DIMENSIONS

UDFN6, 1.6x1.6, 0.5P

CASE 517AP−01

ISSUE O

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.15 AND

0.30 mm FROM TERMINAL.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

A

B

E

D

D2

E2

BOTTOM VIEW

b

e

6X

0.10

B

0.05

A

C

C

K

6X

NOTE 3

2X

0.10 C

PIN ONE

REFERENCE

TOP VIEW

2X

0.10 C

6X

A

A1

(A3)

0.05 C

0.05 C

PLANE

SIDE VIEW

L

6X

1

3

5

6

DIM MIN

MAX

MILLIMETERS

A

0.45

0.55

A1

0.00

0.05

A3

0.13 REF

b

0.20

0.30

D

1.60 BSC

D2

1.10

1.30

E

1.60 BSC

E2

0.45

0.65

e

0.50 BSC

K

0.20

−−−

L

0.20

0.40

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

MOUNTING FOOTPRINT*

L1

DETAIL A

A1

A3

DETAIL B

OPTIONAL

MOLD CMPD

EXPOSED Cu

L

CONSTRUCTION

OPTIONAL

CONSTRUCTION

DETAIL B

DETAIL A

1.26

0.61

0.50 PITCH

0.52

6X

1.90

DIMENSIONS: MILLIMETERS

0.32

1

6X

SOLDERMASK DEFINED

L1

0.00

0.15

ON Semiconductor and

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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

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NUP4107UPMU/D

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