TRIPSET0

TRIPSET1

GND

OUT

HYSTSET

Heat Source

0.1 µF

VIA to Power Ground Plane

Ground Plane for

Thermal

Coupling to Heat

Source

Supply Voltage

Output

10 k

TMP302-Q1

www.ti.com

SLOS889B – OCTOBER 2014 – REVISED JULY 2015

10 Power Supply Recommendations

The TMP302-Q1 family of devices is designed to operate from a single power supply within the range 1.4 V and

3.6 V. No specific power supply sequencing with respect to any of the input or output pins is required. The

1.4 V.

11 Layout

11.1 Layout Guidelines

for this bypass capacitor is 0.1-µF. Additional bypass capacitance can be added to compensate for noisy or high-

impedance power supplies. Place a 10-k

Ω pullup resistor from the open drain OUT pin to the power supply pin

11.2 Layout Example

Figure 14. Layout Example

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11

Product Folder Links: TMP302-Q1