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UCC27524AQDRQ1 Datasheet(PDF) 5 Page - Texas Instruments |
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UCC27524AQDRQ1 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 35 page UCC27524A-Q1 www.ti.com SLVSCC1B – NOVEMBER 2013 – REVISED SEPTEMBER 2015 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage VDD –0.3 20 V DC –0.3 VDD + 0.3 V OUTA, OUTB voltage Repetitive pulse < 200 ns(2) –2 VDD + 0.3 V Output continuous source/sink current IOUT_DC 0.3 A Output pulsed source/sink current (0.5 µs) IOUT_pulsed 5 A INA, INB, ENA, ENB voltage(3) –5 20 V Operating virtual junction temperature, TJ –40 150 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Values are verified by characterization on bench. (3) The maximum voltage on the Input and Enable pins is not restricted by the voltage on the VDD pin. 7.2 ESD Ratings VALUE UNIT Human-body model (HBM), per AEC Q100-002(1) ±2000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per AEC Q100-011 ±750 (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Supply voltage, VDD 4.5 12 18 V Operating junction temperature –40 140 °C Input voltage, INA, INB –2 18 V Enable voltage, ENA and ENB –2 18 V 7.4 Thermal Information UCC27524A-Q1 UCC27524A-Q1 THERMAL METRIC(1) SOIC (D) HVSSOP (DGN) UNIT 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 130.9 71.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 80 65.6 °C/W RθJB Junction-to-board thermal resistance 71.4 7.4 °C/W ψJT Junction-to-top characterization parameter 21.9 7.4 °C/W ψJB Junction-to-board characterization parameter 70.9 31.5 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a 19.6 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Copyright © 2013–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: UCC27524A-Q1 |
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