UCC27524A-Q1

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SLVSCC1B – NOVEMBER 2013 – REVISED SEPTEMBER 2015

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

VDD

–0.3

20

V

DC

–0.3

VDD + 0.3

V

OUTA, OUTB voltage

–2

VDD + 0.3

V

Output continuous source/sink current

0.3

A

5

A

–5

20

V

–40

150

°C

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Values are verified by characterization on bench.

(3)

The maximum voltage on the Input and Enable pins is not restricted by the voltage on the VDD pin.

7.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged-device model (CDM), per AEC Q100-011

±750

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage, VDD

4.5

12

18

V

Operating junction temperature

–40

140

°C

Input voltage, INA, INB

–2

18

V

Enable voltage, ENA and ENB

–2

18

V

7.4 Thermal Information

UCC27524A-Q1

UCC27524A-Q1

SOIC (D)

HVSSOP (DGN)

UNIT

8 PINS

8 PINS

Junction-to-ambient thermal resistance

130.9

71.8

°C/W

Junction-to-case (top) thermal resistance

80

65.6

°C/W

Junction-to-board thermal resistance

71.4

7.4

°C/W

Junction-to-top characterization parameter

21.9

7.4

°C/W

Junction-to-board characterization parameter

70.9

31.5

°C/W

Junction-to-case (bottom) thermal resistance

n/a

19.6

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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