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UCC27531 Datasheet(PDF) 6 Page - Texas Instruments |
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UCC27531 Datasheet(HTML) 6 Page - Texas Instruments |
6 / 45 page UCC27531, UCC27533, UCC27536, UCC27537, UCC27538 SLUSBA7F – DECEMBER 2012 – REVISED JULY 2015 www.ti.com Pin Functions (continued) PIN I/O DESCRIPTION NAME NO. UCC27538DBV 1 VDD I Bias supply input 2 IN1 I Driver non-inverting input 3 GND - Ground (all signals are referenced to this node) 4 OUTL O 5-A sink current output of driver 5 IN2 I Driver non-inverting input 6 OUTH O 2.5-A source current output of driver UCC27531D 1 NC - No connection 2 IN I Driver non-inverting input 3 GND - Ground (all signals are referenced to this node) 4 NC - No connection 5 NC - No connection 6 VDD I Bias supply input 7 OUT O 5-A Sink Current Output of driver and 2.5-A Source Current Output of driver 8 NC - No connection 8 Specifications 8.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) (3) MIN MAX UNIT Supply voltage VDD –0.3 35 V Continuous OUTH, OUTL, OUT –0.3 VDD +0.3 V Pulse OUTH, OUTL, OUT (200 ns) –2 VDD +0.3 V Continuous IN, EN, IN+, IN-, IN1, IN2 –5 27 V Pulse IN, EN, IN+, IN–, IN1, IN2 (1.5 µs) –6.5 27 V Operating virtual junction temperature, TJ –40 150 °C Soldering, 10 sec. 300 Lead temperature °C Reflow 260 Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to GND unless otherwise noted. Currents are positive into, negative out of the specified terminal. See Thermal Information of the datasheet for thermal limitations and considerations of packages. (3) These devices are sensitive to electrostatic discharge; follow proper device handling procedures. 8.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22- ±1000 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: UCC27531 UCC27533 UCC27536 UCC27537 UCC27538 |
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