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LM57 Datasheet(PDF) 5 Page - Texas Instruments |
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LM57 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 40 page VDD GND VSENSE LM57 www.ti.com SNIS152E – MAY 2009 – REVISED JULY 2015 Pin Functions (continued) PIN TYPE EQUIVALENT CIRCUIT DESCRIPTION NAME NO. VTEMP analog voltage output Analog If TRIP TEST = 0, then VTEMP = VTS, temperature sensor output voltage VTEMP 8 Output If TRIP TEST = 1, then VTEMP = VTRIP, temperature trip voltage This pin may be left open if not used. Thermal Pad (WSON — — — Connected to GND package only) 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT Supply voltage −0.3 6 V Voltage at TOVER −0.3 6 V Voltage at TOVER , VTEMP, TRIP-TEST, SENSE1, and SENSE2 −0.3 (VDD + 0.3 V) V Current at any pin 5 mA Storage temperature −65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Soldering process must comply with Reflow Temperature Profile specifications. Refer to www.ti.com/packaging. 7.2 ESD Ratings VALUE UNIT LM57BISD and LM57CISD in WSON package Human body model (HBM) ±5500 Electrostatic discharge V(ESD) Charged-device model (CDM) ±1250 V (1) Machine Model (MM) ±450 LM57FPW and LM57TPW in TSSOP package Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (2) ±2000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22-C101 (3) ±750 (1) The Human Body Model (HBM) is a 100-pF capacitor charged to the specified voltage then discharged through a 1.5-k Ω resistor into each pin. The Machine Model (MM) is a 200 pF capacitor charged to the specified voltage then discharged directly into each pin. The Charged Device Model (CDM) is a specified circuit characterizing an ESD event that occurs when a device acquires charge through some triboelectric (frictional) or electrostatic induction processes and then abruptly touches a grounded object or surface. (2) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (3) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions MIN NOM MAX UNIT Supply voltage 2.4 5.5 V Free air temperature range (TMIN ≤ TA ≤ TMAX) −50 150 °C Copyright © 2009–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LM57 |
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