Electronic Components Datasheet Search |
|
ISO7331FC Datasheet(PDF) 4 Page - Texas Instruments |
|
|
ISO7331FC Datasheet(HTML) 4 Page - Texas Instruments |
4 / 26 page ISO7330C, ISO7330FC, ISO7331C, ISO7331FC SLLSEK9B – JANUARY 2015 – REVISED APRIL 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings (1) MIN MAX UNIT Supply voltage(2) VCC1 , VCC2 –0.5 6 V Voltage (2) INx, OUTx, ENx –0.5 VCC+0.5 (3) V Output current, IO ±15 mA Junction temperature, TJ 150 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground terminal and are peak voltage values. (3) Maximum voltage must not exceed 6 V. 6.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V VESD Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±1500 V (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions MIN TYP MAX UNIT VCC1, VCC2 Supply voltage 3 5.5 V IOH High-level output current –4 mA IOL Low-level output current 4 mA VIH High-level input voltage 2 5.5 V VIL Low-level input voltage 0 0.8 V tui Input pulse duration 40 ns 1 / tui Signaling rate 0 25 Mbps TJ (1) Junction temperature 136 °C TA Ambient temperature -40 25 125 °C (1) To maintain the recommended operating conditions for TJ, see the Thermal Information table. 6.4 Thermal Information DW PACKAGE THERMAL METRIC(1) UNIT (16) PINS RθJA Junction-to-ambient thermal resistance 78.3 RθJCtop Junction-to-case (top) thermal resistance 40.9 RθJB Junction-to-board thermal resistance 42.9 °C/W ψJT Junction-to-top characterization parameter 15.3 ψJB Junction-to-board characterization parameter 42.4 RθJCbot Junction-to-case (bottom) thermal resistance N/A PD (ISO7330) Maximum Power Dissipation by ISO7330 70 VCC1 = VCC2 = 5.5V, TJ = 150°C, CL = PD1 (ISO7330) Maximum Power Dissipation by Side-1 of ISO7330 15pF, Input a 12.5 MHz 50% duty cycle 20 mW square wave PD2 (ISO7330) Maximum Power Dissipation by Side-2 of ISO7330 50 PD (ISO7331) Maximum Power Dissipation by ISO7331 84 VCC1 = VCC2 = 5.5V, TJ = 150°C, CL = PD1 (ISO7331) Maximum Power Dissipation by Side-1 of ISO7331 15pF, Input a 12.5 MHz 50% duty cycle 35 mW square wave PD2 (ISO7331) Maximum Power Dissipation by Side-2 of ISO7331 49 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ISO7330C ISO7330FC ISO7331C ISO7331FC |
Similar Part No. - ISO7331FC |
|
Similar Description - ISO7331FC |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |