NCS2372

http://onsemi.com

6

PACKAGE DIMENSIONS

SOIC−16 WB

CASE 751G−03

ISSUE D

D

14X

B

16X

SEATING

PLANE

S

A

M

0.25

T

16

9

8

1

B

A

e

T

C

q

NOTES:

1. DIMENSIONS ARE IN MILLIMETERS.

2. INTERPRET DIMENSIONS AND TOLERANCES

PER ASME Y14.5M, 1994.

3. DIMENSIONS D AND E DO NOT INLCUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.

5. DIMENSION B DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.13 TOTAL IN

EXCESS OF THE B DIMENSION AT MAXIMUM

MATERIAL CONDITION.

DIM MIN

MAX

MILLIMETERS

A

2.35

2.65

A1

0.10

0.25

B

0.35

0.49

C

0.23

0.32

D 10.15 10.45

E

7.40

7.60

e

1.27 BSC

H 10.05 10.55

h

0.25

0.75

L

0.50

0.90

q

0

7

_

_

11.00

16X

0.58

16X

1.62

1.27

DIMENSIONS: MILLIMETERS

1

PITCH

SOLDERING FOOTPRINT*

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

ON Semiconductor and

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reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any

particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without

limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications

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NCS2372/D

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