MMFT2955E

http://onsemi.com

3

TYPICAL ELECTRICAL CHARACTERISTICS

Figure 3. Transfer Characteristics

Figure 4. On−Resistance versus Drain Current

Figure 5. On−Resistance versus

Gate−to−Source Voltage

Figure 6. On−Resistance versus

Junction Temperature

8

6

4

2

0

10

8

6

4

2

0

−55

°C

25

°C

100

°C

−55

°C

25

°C

100

°C

−55

°C

0.6

0

0.5

0.4

0.3

0.2

0.1

0

24

6

8

100

°C

25

°C

−55

°C

0.5

4

0.4

0.2

0.1

0

0.3

710

13

16

19

0.5

0.4

0.2

0.1

0

0.3

−50

0

50

100

150

FORWARD BIASED SAFE OPERATING AREA

The FBSOA curves define the maximum drain−to−source

voltage and drain current that a device can safely handle

when it is forward biased, or when it is on, or being turned

on. Because these curves include the limitations of

simultaneous high voltage and high current, up to the rating

of the device, they are especially useful to designers of linear

systems. The curves are based on a ambient temperature of

25°C and a maximum junction temperature of 150°C.

Limitations for repetitive pulses at various ambient

temperatures can be determined by using the thermal

response curves. ON Semiconductor Application Note,

AN569, “Transient Thermal Resistance−General Data and

Its Use” provides detailed instructions.

SWITCHING SAFE OPERATING AREA

The switching safe operating area (SOA) is the boundary

that the load line may traverse without incurring damage to

the MOSFET. The fundamental limits are the peak current,

IDM and the breakdown voltage, BVDSS. The switching

SOA is applicable for both turn−on and turn−off of the

devices for switching times less than one microsecond.

Figure 7. Maximum Rated Forward Biased

Safe Operating Area

1

0.1

0.01

0.1

10

100

10

1 s

DC

500 ms

1

THERMAL LIMIT

PACKAGE LIMIT

100 ms

20ms

SINGLE PULSE