MTD15N06VL

http://onsemi.com

7

INFORMATION FOR USING THE DPAK SURFACE MOUNT PACKAGE

RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the

total design. The footprint for the semiconductor packages

must be the correct size to ensure proper solder connection

interface between the board and the package. With the

correct pad geometry, the packages will self align when

subjected to a solder reflow process.

DPAK

5.80

0.228

2.58

0.101

1.6

0.063

6.20

0.244

3.0

0.118

6.172

0.243

mm

inches

SCALE 3:1

POWER DISSIPATION FOR A SURFACE MOUNT DEVICE

The power dissipation for a surface mount device is a

function of the drain pad size. These can vary from the

minimum pad size for soldering to a pad size given for

maximum power dissipation. Power dissipation for a

thermal resistance from the device junction to ambient, and

The values for the equation are found in the maximum

ratings table on the data sheet. Substituting these values

one can calculate the power dissipation of the device. For a

71.4°C/W

= 2.1 Watts

The 71.4°C/W for the DPAK package assumes the use of

0.5 sq. in. source pad on a glass epoxy printed circuit board

to achieve a power dissipation of 2.1 W. There are other

alternatives to achieving higher power dissipation from the

surface mount packages. One is to increase the area of the

drain pad. By increasing the area of the drain pad, the

power dissipation can be increased. Although one can

almost double the power dissipation with this method, one

will be giving up area on the printed circuit board which

can defeat the purpose of using surface mount technology.

shown in Figure 15.

Figure 15. Thermal Resistance versus Drain Pad

Area for the DPAK Package (Typical)

2.1 Watts

Board Material = 0.0625

″

G−10/FR−4, 2 oz Copper

80

100

60

40

20

10

8

6

4

2

0

3.6 Watts

6.0 Watts

A, AREA (SQUARE INCHES)