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Antennas for Wireless M2M Applications

6

Product Specification 11MD-0043-4-PS

Part No. M10382

Quality and Environmental Specifications

Test

Standard

Parameters

PCB Inspection

IPC-6012B, Class 2. Qualification and

Performance Specification for Rigid Printed

Boards - Jan 2007

Assembly

Inspection

IPC-A-610-D, Class 2 “Acceptability of

electronic assemblies”

Temperature

Range

ETSI EN 300 019-2-7 specification T 7.3

-30 °C, +25 °C, +85 °C, operating

Damp Heat

ETSI EN 300 019-2-7 specification T 7.3

+70 °C, 80% RH, 96 hrs, non-

operating

Thermal Shock

ETSI EN 300 019-2-7 specification T 7.3 E

-40 °C ... +85 °C, 200 cycles

Vibration

ISO16750-3

Random vibration, 10~1000Hz,

each 3 axis non-operating

Shock

ISO16750-3

Half-sinusoidal 50g, 6ms, 10time/face,

±X, ±Y and ±Z non-operating

Free Fall

ISO16750-3

1m height, 2 drops on opposite side

ESD Sensitivity

JEDEC, JESD22-A114 ESD Sensitivity

Testing Human Body Model (HBM). Class 2

JEDEC, JESD22-A115 ESD Sensitivity

Testing Machine Model (MM), Class B

+2000V - Human hand assembly

+200V - Machine automatic final

assembly

Shear

IEC 60068-2-21, Test Ue3: Shear

Force of 5N applied to the side of the

PCB

Moisture/Reflow

IPC/JEDEC J-STD-020D.1

MSL3

Storage (Dry

IPC/JEDEC J-STD-033C

MSL3

Solderability

EN/IEC 60068-2-58 Test Td

More than 90% of the electrode

should be covered by solder. Solder

temperature 245 °C ± 5 °C



Moisture Sensitivity

Antenova ships all devices dry packed in trays with desiccant and moisture level indicator sealed in an air tight package.

If on receiving the goods the moisture indicator is pink in color or a puncture of the air tight seal packaging is observed,

then follow J-STD-033 “Handling and Use of Moisture/Reflow Sensitive Surface Mount Devices”.

Please note it is a required process for the modules to be pre-baked before reflow for 3 hours at 125ºC. This

is due to the integrated antenna. The module can be baked in trays that they come packaged in. When baking,

stack no more than 3 trays high to ensure even temperature distribution.

Storage (Dry Packed)

The M10382 modules can be stored for up to 12 months from the date shown on the bag seal when stored in a non-

condensing atmospheric environment of <40°C/90% RH.

Storage (Out of Bag)

The M10382 modules meet MSL Level 3 of the JEDEC specification J-STD-020D - 168 hours Floor Life (out of bag) ≤30

°C/60% RH. After opening, all modules must complete the pre-bake process and all solder reflow processing prior to

expiry of the stated floor life. If the stated floor life expires prior to reflow process then follow J-STD-033 “Handling and

Use of Moisture/Reflow Sensitive Surface Mount Devices”.