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MTB33N10ET4 Datasheet(PDF) 7 Page - ON Semiconductor |
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MTB33N10ET4 Datasheet(HTML) 7 Page - ON Semiconductor |
7 / 10 page MTB33N10E http://onsemi.com 7 INFORMATION FOR USING THE D2PAK SURFACE MOUNT PACKAGE RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. mm inches 0.33 8.38 0.08 2.032 0.04 1.016 0.63 17.02 0.42 10.66 0.12 3.05 0.24 6.096 POWER DISSIPATION FOR A SURFACE MOUNT DEVICE The power dissipation for a surface mount device is a function of the drain pad size. These can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RθJA, the thermal resistance from the device junction to ambient, and the operating temperature, TA. Using the values provided on the data sheet, PD can be calculated as follows: PD = TJ(max) − TA RθJA The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature TA of 25°C, one can calculate the power dissipation of the device. For a D2PAK device, PD is calculated as follows. PD = 150°C − 25°C 50°C/W = 2.5 Watts The 50°C/W for the D2PAK package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 2.5 Watts. There are other alternatives to achieving higher power dissipation from the surface mount packages. One is to increase the area of the drain pad. By increasing the area of the drain pad, the power dissipation can be increased. Although one can almost double the power dissipation with this method, one will be giving up area on the printed circuit board which can defeat the purpose of using surface mount technology. For example, a graph of RθJA versus drain pad area is shown in Figure 16. Figure 16. Thermal Resistance versus Drain Pad Area for the D2PAK Package (Typical) 2.5 Watts A, Area (square inches) Board Material = 0.0625″ G−10/FR−4, 2 oz Copper TA = 25°C ° 60 70 50 40 30 20 16 14 12 10 8 6 4 2 0 3.5 Watts 5 Watts |
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