Electronic Components Datasheet Search |
|
MTB55N06Z Datasheet(PDF) 1 Page - ON Semiconductor |
|
MTB55N06Z Datasheet(HTML) 1 Page - ON Semiconductor |
1 / 6 page © Semiconductor Components Industries, LLC, 2006 August, 2006 − Rev. 3 1 Publication Order Number: MTB55N06Z/D MTB55N06Z Preferred Device Power MOSFET 55 Amps, 60 Volts N−Channel D2PAK This Power MOSFET is designed to withstand high energy in the avalanche mode and switch efficiently. This high energy device also offers a drain−to−source diode with fast recovery time. Designed for high voltage, high speed switching applications in power supplies, PWM motor controls and other inductive loads, the avalanche energy capability is specified to eliminate the guesswork in designs where inductive loads are switched and offer additional safety margin against unexpected voltage transients. • Avalanche Energy Capability Specified at Elevated Temperature • Source−to−Drain Diode Recovery Time Comparable to a Discrete Fast Recovery Diode • Low Stored Gate Charge for Efficient Switching • Internal Source−to−Drain Diode Designed to Replace External Zener Transient Suppressor−Absorbs High Energy in the Avalanche Mode • ESD Protected. Designed to Typically Withstand 400 V Machine Model and 4000 V Human Body Model. MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Rating Symbol Value Unit Drain−to−Source Voltage VDSS 60 Vdc Drain−to−Gate Voltage (RGS = 1.0 MΩ) VDGR 60 Vdc Gate−to−Source Voltage − Continuous − Non−Repetitive (tp ≤ 10 ms) VGS VGSM ± 20 ± 40 Vdc Vpk Drain Current − Continuous @ TC = 25°C − Continuous @ TC = 100°C − Single Pulse (tp ≤ 10 μs) ID ID IDM 55 35.5 165 Adc Apk Total Power Dissipation @ TC = 25°C Derate above 25°C Total Power Dissipation @ TA = 25°C (Note 1.) PD 113 0.91 2.5 Watts W/°C Operating and Storage Temperature Range TJ, Tstg − 55 to 150 °C Single Pulse Drain−to−Source Avalanche Energy − Starting TJ = 25°C (VDD = 25 Vdc, VDS = 60 Vdc, VGS = 10 Vdc, Peak IL = 55 Apk, L = 0.3 mH, RG = 25 Ω) EAS 454 mJ Thermal Resistance − Junction to Case − Junction to Ambient − Junction to Ambient (Note 1.) RθJC RθJC RθJA 1.1 62.5 50 °C/W Maximum Lead Temperature for Soldering Purposes, 1/8″ from case for 10 seconds TL 260 °C 1. When surface mounted to an FR4 board using the minimum recommended pad size. MARKING DIAGRAM & PIN ASSIGNMENT MTB55N06Z YWW 1 Gate 4 Drain 2 Drain 3 Source 55 AMPERES 60 VOLTS RDS(on) = 18 mΩ Device Package Shipping ORDERING INFORMATION MTB55N06Z D2PAK 50 Units/Rail D2PAK CASE 418B STYLE 2 1 2 3 4 http://onsemi.com N−Channel D S G MTB55N06Z = Device Code Y = Year WW = Work Week MTB55N06ZT4 D2PAK 800/Tape & Reel Preferred devices are recommended choices for future use and best overall value. |
Similar Part No. - MTB55N06Z |
|
Similar Description - MTB55N06Z |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |