LE25S81A datasheet(4/51 Pages) ONSEMI

Part #	LE25S81A

Description	Serial Flash Memory

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Manufacturer	ONSEMI [ON Semiconductor]

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LE25S81A

www.onsemi.com

4

Package Dimensions

unit : mm

LE25S81AFDTWG

VSOIC8 NB

CASE 753AA

ISSUE O

SEATING

PLANE

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE PROTRUSION SHALL

BE 0.10mm IN EXCESS OF MAXIMUM MATERIAL

CONDITION.

4. DIMENSION D DOES NOT INCLUDE MOLD FLASH,

PROTRUSIONS, OR GATE BURRS. MOLD FLASH,

PROTRUSIONS, OR GATE BURRS SHALL NOT

EXCEED 0.15mm PER SIDE. DIMENSION E DOES

NOT INCLUDE INTERLEAD FLASH OR

PROTRUSION. INTERLEAD FLASH OR

PROTRUSION SHALL NOT EXCEED 0.25mm PER

SIDE. DIMENSIONS D AND E ARE DETERMINED AT

DATUM F.

5. DATUMS A AND B ARE TO BE DETERMINED AT

DATUM F.

6. A1 IS DEFINED AS THE VERTICAL DISTANCE

FROM THE SEATING PLANE TO THE LOWEST

POINT ON THE PACKAGE BODY.

A

DIM

MIN

MAX

MILLIMETERS

A

0.65

0.85

b

0.31

0.51

e

1.27 BSC

A1

0.05

C

M

0.25

GENERIC

MARKING DIAGRAM*

*This information is generic. Please refer

to device data sheet for actual part

DIMENSION: MILLIMETERS

*For additional information on our Pb-Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

L2

0.25 BSC

A

TOP VIEW

C

0.20

A-B D

C

0.10

NOTE 5

C

0.10

b

8X

B

C

8X

SIDE VIEW

END VIEW

DETAIL A

7.00

8X

1.52

8X

0.60

1.27

PITCH

RECOMMENDED

1

L

F

SEATING

PLANE

DETAIL A

D

L2

A1

C

NOTE 6

1

4

5

8

C

0.10

A-B

NOTE 5

e

c

0.17

0.25

L

0.40

1.27

XXXXX = Specific Device Code

A

= Assembly Location

L

= Wafer Lot

Y

= Year

W

= Work Week

= Pb-Free Package

XXXXXXXXX

ALYWX

1

8

2X

NOTE 4

2X 4 TIPS

C

0.10

2X

NOTE 4

D

4.90 BSC

E

6.00 BSC

E1

3.90 BSC

E

E1

D

(Note: Microdot may be in either location)

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LE25S81A Datasheet(PDF) 4 Page - ON Semiconductor

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