NTND31015NZ

www.onsemi.com

5

PACKAGE DIMENSIONS

XLLGA6 0.90x0.65

CASE 713AC

ISSUE O

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994 .

2. CONTROLLING DIMENSION: MILLIMETERS.

3. POSITIONAL TOERANCE APPLIES TO ALL

SIX LEADS.

A

D

E

B

C

0.05

PIN ONE

2X

REFERENCE

2X

TOP VIEW

SIDE VIEW

BOTTOM VIEW

A

L

C

C

0.05

C

0.05

C

0.05

A1

SEATING

PLANE

e3

e

2X

NOTE 3

b2

4X

0.10

C

0.05

C

A B

B

DIM

MIN

MAX

MILLIMETERS

A

0.340

0.440

A1

0.000

0.050

b

0.200

0.300

D

0.900 BSC

b2

0.080

0.180

E

0.650 BSC

e

0.295 BSC

L

0.215

0.315

23

6

4

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

DIMENSIONS: MILLIMETERS

L2

0.115

0.215

1

4X

0.300

0.300

0.300

2X

0.400

0.781

e1

0.340 BSC

e2

0.300 BSC

e3

0.208 BSC

e4

0.158 BSC

M

0.340

PITCH

PITCH

2X

4X

0.180

1

0.345

PITCH

RECOMMENDED

M

5

b

2X

e2

e1

e4

L2

4X

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