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NVLUS4C12NTAG Datasheet(PDF) 1 Page - ON Semiconductor

Part # NVLUS4C12NTAG
Description  Single N-Channel Power MOSFET
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NVLUS4C12NTAG Datasheet(HTML) 1 Page - ON Semiconductor

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© Semiconductor Components Industries, LLC, 2014
December, 2014 − Rev. 0
1
Publication Order Number:
NVLUS4C12N/D
NVLUS4C12N
Power MOSFET
30 V, 10.7 A, Single N−Channel,
2.0x2.0x0.55 mm
mCoolt UDFN6 Package
Features
Low Profile UDFN 2.0 x 2.0 x 0.55 mm for Board Space Saving with
Exposed Drain Pads for Excellent Thermal Conduction
Ultra Low RDS(on) to Reduce Conduction Losses
Optimized Gate Charge to Reduce Switching Losses
Low Capacitance to Minimize Driver Losses
NV Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
Power Load Switch
Synch DC−DC Converters
Wireless Charging Circuit
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol
Value
Unit
Drain-to-Source Voltage
VDSS
30
V
Gate-to-Source Voltage
VGS
±20
V
Continuous Drain
Current (Note 1)
Steady
State
TA = 25°C
ID
10.7
A
TA = 85°C
7.7
t
≤ 5 s
TA = 25°C
15.1
Power Dissipa-
tion (Note 1)
Steady
State
TA = 25°C
PD
1.54
W
t
≤ 5 s
TA = 25°C
3.1
Continuous Drain
Current (Note 2)
Steady
State
TA = 25°C
ID
6.8
A
TA = 85°C
4.9
Power Dissipation (Note 2)
TA = 25°C
PD
0.63
W
Pulsed Drain Current
tp = 10 ms
IDM
43
A
MOSFET Operating Junction and Storage
Temperature
TJ,
TSTG
-55 to
150
°C
Source Current (Body Diode) (Note 1)
IS
1.55
A
Lead Temperature for Soldering Purposes
(1/8
″ from case for 10 s)
TL
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces).
2. Surface-mounted on FR4 board using the minimum recommended pad size,
2 oz. Cu.
www.onsemi.com
N−CHANNEL MOSFET
30 V
12 m
W @ 4.5 V
9 m
W @ 10 V
RDS(on) MAX
ID MAX
V(BR)DSS
MOSFET
UDFN6
(
mCOOL])
CASE 517BG
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
ORDERING INFORMATION
AG = Specific Device Code
M = Date Code
G = Pb−Free Package
AGM
G
G
1
MARKING DIAGRAM
(Top View)
(Note: Microdot may be in either location)
10.7 A
D
S
G
PIN CONNECTIONS
Pin 1
D
S
1
2
3
6
5
4
D
D
S
D
D
G
D
S
19 m
W @ 3.3 V
15 m
W @ 3.7 V


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