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NVMFS6B05NT3G Datasheet(PDF) 5 Page - ON Semiconductor |
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NVMFS6B05NT3G Datasheet(HTML) 5 Page - ON Semiconductor |
5 / 6 page NVMFS6B05N www.onsemi.com 5 TYPICAL CHARACTERISTICS Figure 12. GFS vs. ID Figure 13. IPEAK vs. TAV ID, DRAIN CURRENT (A) TAV, TIME IN AVALANCHE (sec) 100 60 10 0 0 10 30 50 60 80 0.001 0.0001 1 10 100 Figure 14. Thermal Response PULSE TIME (sec) 0.01 0.001 10 1 0.0001 0.00001 0.1 0.000001 0.001 0.01 0.1 1 10 100 100 1000 50% Duty Cycle 20% 10% 5% 2% 1% Single Pulse 0.01 NTMFS6B05N, 650 mm2, 2 oz, Cu Single Layer Pad 100 °C 25 °C 20 40 70 20 30 40 50 70 80 90 DEVICE ORDERING INFORMATION Device Marking Package Shipping† NVMFS6B05NT1G 6B05N DFN5 (Pb−Free) 1500 / Tape & Reel NVMFS6B05NWFT1G 6B05WF DFN5 (Pb−Free, Wettable Flanks) 1500 / Tape & Reel NVMFS6B05NT3G 6B05N DFN5 (Pb−Free) 5000 / Tape & Reel NVMFS6B05NWFT3G 6B05WF DFN5 (Pb−Free, Wettable Flanks) 5000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. |
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