NVTFS4C06N

http://onsemi.com

6

PACKAGE DIMENSIONS

WDFN8 3.3x3.3, 0.65P

CASE 511AB

ISSUE D

M

1.40

1.50

q

0

−−−

_

1.60

12

_

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION D1 AND E1 DO NOT INCLUDE MOLD FLASH

PROTRUSIONS OR GATE BURRS.

123 4

5

6

TOP VIEW

SIDE VIEW

BOTTOM VIEW

D1

E1

q

D

E

B

A

0.20 C

0.20 C

2X

2X

DIM

MIN

NOM

MILLIMETERS

A

0.70

0.75

A1

0.00

−−−

b

0.23

0.30

c

0.15

0.20

D

D1

2.95

3.05

D2

1.98

2.11

E

E1

2.95

3.05

E2

1.47

1.60

e

0.65 BSC

G

0.30

0.41

K

0.65

0.80

L

0.30

0.43

L1

0.06

0.13

A

0.10 C

0.10 C

DETAIL A

14

8

L1

e/2

8X

D2

G

E2

K

b

A

0.10

B

C

0.05

C

L

DETAIL A

A1

e

6X

c

4X

C

SEATING

PLANE

5

MAX

0.80

0.05

0.40

0.25

3.15

2.24

3.15

1.73

0.51

0.95

0.56

0.20

M

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.65

0.42

0.75

2.30

3.46

PACKAGE

8X

0.055

0.059

0

−−−

_

0.063

12

_

0.028

0.030

0.000

−−−

0.009

0.012

0.006

0.008

0.116

0.120

0.078

0.083

0.116

0.120

0.058

0.063

0.026 BSC

0.012

0.016

0.026

0.032

0.012

0.017

0.002

0.005

0.031

0.002

0.016

0.010

0.124

0.088

0.124

0.068

0.020

0.037

0.022

0.008

MIN

NOM

INCHES

MAX

7

8

PITCH

3.60

0.57

0.47

OUTLINE

DIMENSION: MILLIMETERS

3.30 BSC

3.30 BSC

0.130 BSC

0.130 BSC

2.37

0.66

4X

E3

0.23

0.30

0.40

0.009

0.012

0.016

E3

4X

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