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Material Content Data Sheet

Sales Product Name

ICE3AR4780JZ

Issued

29. August 2013

MA#

MA001066062

Package

PG-DIP-7-3

Weight*

645.07 mg

Construction Element

Material Group

Substances

CAS#

if applicable

Weight

[mg]

Average

Mass

[%]

Sum

[%]

Average

Mass

[ppm]

Sum

[ppm]

chip

inorganic material

silicon

7440-21-3

3.649

0.57

0.57

5657

5657

leadframe

inorganic material

phosphorus

7723-14-0

0.048

0.01

75

non noble metal

zinc

7440-66-6

0.194

0.03

300

non noble metal

iron

7439-89-6

3.872

0.60

6002

non noble metal

copper

7440-50-8

157.218

24.37

25.01

243723

250100

wire

noble metal

gold

7440-57-5

0.418

0.06

0.06

649

649

encapsulation

organic material

carbon black

1333-86-4

2.349

0.36

3641

plastics

epoxy resin

-

63.418

9.83

98312

inorganic material

silicondioxide

60676-86-0

403.995

62.63

72.82

626284

728237

leadfinish

non noble metal

tin

7440-31-5

6.460

1.00

1.00

10014

10014

plating

noble metal

silver

7440-22-4

1.594

0.25

0.25

2471

2471

glue

plastics

epoxy resin

-

0.324

0.05

503

noble metal

silver

7440-22-4

1.528

0.24

0.29

2369

2872

*deviation

< 10%

Sum in total:

100,00

1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

Company

Infineon Technologies AG

Address

81726 München

Internet

www.infineon.com