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ESD7504 Datasheet(PDF) 2 Page - ON Semiconductor |
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ESD7504 Datasheet(HTML) 2 Page - ON Semiconductor |
2 / 6 page ESD7504 http://onsemi.com 2 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Symbol Parameter IPP Maximum Peak Pulse Current VC Clamping Voltage @ IPP VRWM Working Peak Reverse Voltage IR Maximum Reverse Leakage Current @ VRWM VBR Breakdown Voltage @ IT IT Test Current RDYN Dynamic Resistance *See Application Note AND8308/D for detailed explanations of datasheet parameters. Uni−Directional TVS IPP IPP V I IR IT VRWM VCL VBR VCL RDYN RDYN ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified) Parameter Symbol Conditions Min Typ Max Unit Reverse Working Voltage VRWM I/O Pin to GND 3.3 V Breakdown Voltage VBR IT = 1 mA, I/O Pin to GND 4.0 5.0 V Reverse Leakage Current IR VRWM = 3.3 V, I/O Pin to GND 1.0 mA Clamping Voltage (Note 1) VC IEC61000−4−2, ±8 kV Contact See Figures 1 and 2 V Clamping Voltage TLP (Note 2) See Figures 5 through 6 VC IPP = 8 A IPP = −8 A IEC 61000−4−2 Level 2 equivalent (±4 kV Contact, ±4 kV Air) 10.2 −4.5 V IPP = 16 A IPP = −16 A IEC 61000−4−2 Level 4 equivalent (±8 kV Contact, ±15 kV Air) 13.7 −8.1 Junction Capacitance CJ VR = 0 V, f = 1 MHz between I/O Pins and GND 0.55 pF Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. For test procedure see Figures 3 and 4 and application note AND8307/D. 2. ANSI/ESD STM5.5.1 − Electrostatic Discharge Sensitivity Testing using Transmission Line Pulse (TLP) Model. TLP conditions: Z0 = 50 W, tp = 100 ns, tr = 4 ns, averaging window; t1 = 30 ns to t2 = 60 ns. Figure 1. IEC61000−4−2 +8 kV Contact Clamping Voltage Figure 2. IEC61000−4−2 −8 kV Contact Clamping Voltage TIME (ns) TIME (ns) 0 −10 −20 −30 −40 −50 −60 −70 −80 −90 −20 0 20 40 60 80 100 140 120 90 80 70 60 50 40 30 20 10 0 −10 −20 0 20 40 60 80 100 140 120 10 |
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