ESD7371, SZESD7371 Series

http://onsemi.com

8

PACKAGE DIMENSIONS

SOD−923

CASE 514AB

ISSUE C

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.

MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF

BASE MATERIAL.

4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO-

TRUSIONS, OR GATE BURRS.

DIM

MIN

NOM

MAX

MILLIMETERS

A

0.34

0.37

0.40

b

0.15

0.20

0.25

c

0.07

0.12

0.17

D

0.75

0.80

0.85

E

0.55

0.60

0.65

0.95

1.00

1.05

L

0.19 REF

0.013

0.015

0.016

0.006

0.008

0.010

0.003

0.005

0.007

0.030

0.031

0.033

0.022

0.024

0.026

0.037

0.039

0.041

0.007 REF

MIN

NOM

MAX

INCHES

D

E

c

A

−Y−

−X−

2

1

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

See Application Note AND8455/D for more mounting details

1.20

2X

0.25

2X

0.36

PACKAGE

OUTLINE

b

2X

0.08 XY

TOP VIEW

SIDE VIEW

2X

BOTTOM VIEW

L2

L

2X

L2

0.05

0.10

0.15

0.002

0.004

0.006

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ESD7371/D

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