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OPA656 Datasheet(PDF) 4 Page - Texas Instruments |
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OPA656 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 33 page OPA656 SBOS196H – DECEMBER 2001 – REVISED SEPTEMBER 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage (Total Bipolar Supplies) ±6.5 V Internal power dissipation See Thermal Information Differential input voltage –VS +VS Input voltage –VS +VS Junction temperature, TJ 150 °C Storage temperature, Tstg –65 125 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500 V Machine Model ±200 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VS Total supply voltage 8 10 12 V TA Ambient temperature –40 25 85 °C 7.4 Thermal Information OPA656 THERMAL METRIC(1) D (SOIC) DBV (SOT-23) UNIT 8 PINS 5 PINS RθJA Junction-to-ambient thermal resistance 125 150 °C/W RθJC(top) Junction-to-case (top) thermal resistance 85.2 140.8 °C/W RθJB Junction-to-board thermal resistance 75.9 62.8 °C/W ψJT Junction-to-top characterization parameter 26.2 24.4 °C/W ψJB Junction-to-board characterization parameter 75.4 61.8 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — — °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2001–2015, Texas Instruments Incorporated Product Folder Links: OPA656 |
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