NS6A5.0AFT3G, SZNS6A5.0AFT3G Series

http://onsemi.com

5

PACKAGE DIMENSIONS

SMA−FL

CASE 403AA

ISSUE O

D

E

b

L

c

SOLDER FOOTPRINT*

DIMENSIONS: MILLIMETERS

5.56

1.76

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

1.30

RECOMMENDED

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

DIM

MIN

MAX

MILLIMETERS

A

0.90

1.10

b

1.25

1.65

c

0.15

0.30

D

2.40

2.80

TOP VIEW

E1

BOTTOM VIEW

2X

2X

SIDE VIEW

A

PLANE

E

4.80

5.40

E1

4.00

4.60

L

0.70

1.10

ON Semiconductor and

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arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

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NS6A5.0AF/D

SURMETIC is a trademark of Semiconductor Components Industries, LLC.

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