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NTSAF545 Datasheet(PDF) 4 Page - ON Semiconductor |
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NTSAF545 Datasheet(HTML) 4 Page - ON Semiconductor |
4 / 5 page NTSAF545 www.onsemi.com 4 TYPICAL CHARACTERISTICS Figure 7. Forward Power Dissipation IF(AV), AVERAGE FORWARD CURRENT (A) 0 0 2 10 24 IPK/IAV = 5 13 4 6 8 Square Wave IPK/IAV = 10 DC IPK/IAV = 20 0.01 0.1 1 10 100 0.000001 0.00001 0.0001 1000 0.001 0.01 0.1 1 10 100 Figure 8. Typical Thermal Characteristics t, PULSE TIME (S) 50% Duty Cycle 20% 10% 5% 2% 1% Single Pulse Assumes 25 °C ambient and soldered to a 600 mm2 − oz copper pad on PCB 0.01 0.1 1 10 0.000001 0.00001 0.0001 1000 0.001 0.01 0.1 1 10 100 Figure 9. Typical Transient Thermal Response Characteristics, Junction−to−Case t, PULSE TIME (S) 50% Duty Cycle 20% 10% 5% 2% 1% Single Pulse |
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