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SA5532AD Datasheet(PDF) 11 Page - Texas Instruments

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Part # SA5532AD
Description  Dual Low-Noise Operational Amplifiers
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

SA5532AD Datasheet(HTML) 11 Page - Texas Instruments

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RIN
RG
RF
VOUT
VIN
NE5532, NE5532A, SA5532, SA5532A
www.ti.com
SLOS075J – NOVEMBER 1979 – REVISED JANUARY 2015
10 Power Supply Recommendations
The NE5532x and SA5532x devices are specified for operation over the range of ±5 to ±15 V; many
specifications apply from 0°C to 70°C (NE5532x) and -40°C to 85°C (SA5532x). The Typical Characteristics
section presents parameters that can exhibit significant variance with regard to operating voltage or temperature.
CAUTION
Supply voltages outside of the ±22 V range can permanently damage the device (see
the Absolute Maximum Ratings).
Place 0.1-
μF bypass capacitors close to the power-supply pins to reduce errors coupling in from noisy or high
impedance power supplies. For more detailed information on bypass capacitor placement, refer to the Layout
Guidelines.
11 Layout
11.1 Layout Guidelines
For best operational performance of the device, use good PCB layout practices, including:
Noise can propagate into analog circuitry through the power pins of the circuit as a whole and the operational
amplifier. Bypass capacitors are used to reduce the coupled noise by providing low impedance power
sources local to the analog circuitry.
Connect low-ESR, 0.1-
μF ceramic bypass capacitors between each supply pin and ground, placed as
close to the device as possible. A single bypass capacitor from V+ to ground is applicable for single
supply applications.
Separate grounding for analog and digital portions of circuitry is one of the simplest and most-effective
methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to ground planes.
A ground plane helps distribute heat and reduces EMI noise pickup. Make sure to physically separate digital
and analog grounds, paying attention to the flow of the ground current. For more detailed information, refer to
Circuit Board Layout Techniques, SLOA089.
To reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. If
it is not possible to keep them separate, it is much better to cross the sensitive trace perpendicular as
opposed to in parallel with the noisy trace.
Place the external components as close to the device as possible. Keeping RF and RG close to the inverting
input minimizes parasitic capacitance, as shown in Layout Example.
Keep the length of input traces as short as possible. Always remember that the input traces are the most
sensitive part of the circuit.
Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly reduce
leakage currents from nearby traces that are at different potentials.
11.2 Layout Example
Figure 8. Operational Amplifier Schematic for Noninverting Configuration
Copyright © 1979–2015, Texas Instruments Incorporated
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11
Product Folder Links: NE5532 NE5532A SA5532 SA5532A


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