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SOD128-FL Datasheet(PDF) 1 Page - Amkor Technology |
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SOD128-FL Datasheet(HTML) 1 Page - Amkor Technology |
1 / 2 page POWER DISCRETE Data Sheet Questions? Contact us: marketing@amkor.com Visit Amkor Technology online for locations and to view the most current product information. SOD128-FL DS613A Rev Date: 5-14 Process Highlights • Bare copper leadframe with no plating • Interconnect: Cu clips technology for better electrical and thermal performance • Plating: 100% matte Sn • Marking: Pen type laser Standard Materials • Leadframe: Bare copper • Die attach: Solder paste • Interconnect: Cu clips • Mold compound: Halogen free Reliability Qualification Amkor devices are assembled with proven reliable semiconductor materials. All test includes pre-condition of: Ta = 85°C/Rh = 85%, 16 hrs with solder dip, Ta = 265°C, 10s • Temperature & Humidity Storage, Ta = 85°C/Rh = 85%, 500 hrs • High Temperature Storage, Ta = 150°C, 500 hrs • Pressure Cooker, Ta = 121°C/Rh = 100%/P = 2 atm, 144 hrs • Temperature Cycle, -65~150°C, 300 cycles Test Service Amkor offers full turnkey business for all power discrete products. We have the capability to test various type of power devices including MOSFETs, bipolar transistors, IGBTs, diodes, regulator ICs/intelligent power devices, etc. • Amkor power discrete test capability: – Static test (DC) – Dynamic test (AC, Switching/Trr, Capacitance/Rg) – Destruction test (Inductive load/VSUS, I Latch, Surge, Isolation/VIL) – Thermal Resistance (ΔVDS, ΔmV, etc.) • Program generation/conversion • Failure analysis • Available test/handling technology • Integrated marking, vision inspection and tape & reel services Introduction The SOD128-FL package is part of the FLAT series of compact surface mount packages which allow communication equipment to be miniaturized. The Cu clip structure of interconnect features reduces electrical resistance and enhance thermal performance compared to wire-bonded products. This package may also be know as: • M-Flat Application The FLAT packages are suitable for the application of high‑efficiency diodes, in small & medium size: • Schottky Barrier Diodes (SBDs) • Rectifier Diodes • Zener Diodes Features • Cu connector structure to reduce inductance and resistance • Enhance thermal property • Turnkey with test and packing services • Green materials: Pb-free plating & halogen-free mold compound New Developments • Larger/higher density leadframe strips • Environmentally friendly Pb-free solder paste |
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