OPA2211-EP

SBOS761 – NOVEMBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

40

V

Input voltage

(V–) – 0.5

(V+) + 0.5

V

Input current (any pin except power-supply pins)

–10

10

mA

Continuous

150

°C

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

6.2 ESD Ratings

VALUE

UNIT

±3000

Electrostatic

V

discharge

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage (V+ – V–)

4.5 (±2.25)

36 (±18)

V

–55

125

°C

6.4 Thermal Information

OPA2211-EP

DRG (WSON)

UNIT

8 PINS

Junction-to-ambient thermal resistance

47.3

°C/W

Junction-to-case (top) thermal resistance

51.8

°C/W

Junction-to-board thermal resistance

21.8

°C/W

Junction-to-top characterization parameter

0.7

°C/W

Junction-to-board characterization parameter

21.9

°C/W

Junction-to-case (bottom) thermal resistance

4.2

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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