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OPA228PG4 Datasheet(PDF) 5 Page - Texas Instruments

Part # OPA228PG4
Description  High Precision, Low Noise Operational Amplifiers
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

OPA228PG4 Datasheet(HTML) 5 Page - Texas Instruments

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OPA227, OPA2227, OPA4227
OPA228, OPA2228, OPA4228
www.ti.com
SBOS110B – MAY 1998 – REVISED JUNE 2015
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Supply voltage, Vs = (V+) - (V-)
36
V
Voltage
(V–) – 0.7
(V+) +0.7
V
Signal input terminals
Current
20
mA
Output short-circuit(2)
Continuous
Operating temperature
–55
125
°C
Junction temperature
150
°C
Tstg
Storage temperature
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
Short-circuit to ground, one amplifier per package
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
Supply voltage, Vs = (V+) - (V-)
±2.5
±15
±18
V
Specified temperature
–40
85
°C
6.4 Thermal Information: OPA227U/UA and OPA228U/UA
OPA227U/UA
OPA2227U/UA
OPA4227UA
OPA228U/UA
OPA2228U/UA
OPA4228UA
THERMAL METRIC(1)
UNIT
D (SOIC)
D (SOIC)
D (SOIC)
8 PINS
8 PINS
14 PINS
RθJA
Junction-to-ambient thermal resistance
110.1
101.9
65
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
52.2
46.3
23.1
°C/W
RθJB
Junction-to-board thermal resistance
52.3
45.5
20.3
°C/W
ψJT
Junction-to-top characterization parameter
10.4
6.6
1.8
°C/W
ψJB
Junction-to-board characterization parameter
51.5
42.8
19.9
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
N/A
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
Copyright © 1998–2015, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links: OPA227 OPA2227 OPA4227 OPA228 OPA2228 OPA4228


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