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LMV7239QM7 Datasheet(PDF) 4 Page - Texas Instruments

Part # LMV7239QM7
Description  Open-Drain and Push-Pull Output
Download  30 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

LMV7239QM7 Datasheet(HTML) 4 Page - Texas Instruments

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LMV7235, LMV7239, LMV7239-Q1
SNOS532N – SEPTEMBER 2000 – REVISED APRIL 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
(1)
Over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
Differential Input Voltage
± Supply Voltage
V
Output Short Circuit Duration
See (2)
Supply Voltage (V+ - V)
6
V
SOLDERING INFORMATION
Infrared or Convection (20 sec)
235
°C
Wave Soldering (10 sec)
260 (lead temp)
°C
Voltage at Input/Output Pins
(V+) +0.3, (V)
−0.3
V
Current at Input Pin (3)
±10
mA
Storage Temperature, Tstg
-65
150
°C
Junction Temperature,TJ
150
°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of ±30mA over long term may adversely
affect reliability.
(3)
Limiting input pin current is only necessary for input voltages that exceed absolute maximum input voltage ratings.
6.2 ESD Ratings, LMV7235 and LMV7239
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±1000
V(ESD)
Electrostatic discharge
V
Machine model (MM)
±100
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions.
6.3 ESD Ratings, LMV7239-Q1
VALUE
UNIT
Human-body model (HBM), per AEC Q100-002(1)
±1000
Electrostatic
V(ESD)
Machine model (MM)
±100
V
discharge
Charged-device model (CDM), per AEC Q100-011(1)
DBV package only
±750
(1)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions.
6.4 Recommended Operating Conditions
MIN
MAX
UNIT
Supply Voltages (V+ - V)
2.7
5.5
V
Temperature Range(1)
LMV7235/LMV7239
−40
85
°C
LMV7239Q
−40
125
°C
(1)
The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is
PD = (TJ(MAX) – TA) / θJA. All numbers apply for packages soldered directly onto a PC Board.
6.5 Thermal Information
SC70
SOT-23
THERMAL METRIC(1)
UNIT
5 PINS
5 PINS
RθJA
Junction-to-ambient thermal resistance
478
265
°C/W
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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Copyright © 2000–2015, Texas Instruments Incorporated
Product Folder Links: LMV7235 LMV7239 LMV7239-Q1


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