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Material Content Data Sheet

Sales Product Name

2N7002DW H6327

Issued

29. August 2013

MA#

MA000931250

Package

PG-SOT363-6-1

Weight*

6.30 mg

Construction Element

Material Group

Substances

CAS#

if applicable

Weight

[mg]

Average

Mass

[%]

Sum

[%]

Average

Mass

[ppm]

Sum

[ppm]

chip

non noble metal

tin

7440-31-5

0.002

0.04

394

noble metal

gold

7440-57-5

0.010

0.15

1528

inorganic material

silicon

7440-21-3

0.147

2.33

2.52

23312

25234

leadframe

inorganic material

silicon

7440-21-3

0.001

0.01

91

non noble metal

titanium

7440-32-6

0.003

0.05

458

non noble metal

chromium

7440-47-3

0.009

0.14

1373

non noble metal

copper

7440-50-8

2.869

45.57

45.77

455656

457578

wire

non noble metal

copper

7440-50-8

0.010

0.16

0.16

1640

1640

encapsulation

organic material

carbon black

1333-86-4

0.030

0.47

4728

plastics

epoxy resin

-

0.640

10.16

101643

inorganic material

silicondioxide

60676-86-0

2.307

36.64

47.27

366387

472758

leadfinish

non noble metal

tin

7440-31-5

0.213

3.39

3.39

33863

33863

plating

noble metal

silver

7440-22-4

0.056

0.89

0.89

8927

8927

*deviation

< 10%

Sum in total:

100,00

1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

Company

Infineon Technologies AG

Address

81726 München

Internet

www.infineon.com