INA196AIDBVRG4 datasheet(4/33 Pages) TI1

Part #	INA196AIDBVRG4

Description	Current Shunt Monitor ??6 V to 80 V Common-Mode Range

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INA193, INA194, INA195

INA196, INA197, INA198

SBOS307G – MAY 2004 – REVISED JANUARY 2015

www.ti.com

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply Voltage

18

V

Analog Inputs, VIN+, VIN−

–18

18

V

Differential (VIN+) – (VIN−)

–18

18

V

Common-Mode(2)

–16

80

V

Analog Output, Out(2)

GND – 0.3

(V+) + 0.3

V

Input Current Into Any Pin(2)

5

mA

Operating Temperature

–55

150

°C

Junction Temperature

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Input voltage at any pin may exceed the voltage shown if the current at that pin is limited to 5mA.

7.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±4000

V(ESD)

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-C101,

±1000

all pins(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCM

Common-mode input voltage

12

V

V+

Operating supply voltage

12

V

TA

Operating free-air temperature

-40

125

ºC

7.4 Thermal Information

INA19x

THERMAL METRIC(1)

DBV

UNIT

5 PINS

RθJA

Junction-to-ambient thermal resistance

221.7

RθJC(top)

Junction-to-case (top) thermal resistance

144.7

RθJB

Junction-to-board thermal resistance

49.7

°C/W

ψJT

Junction-to-top characterization parameter

26.1

ψJB

Junction-to-board characterization parameter

49.0

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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Product Folder Links: INA193 INA194 INA195 INA196 INA197 INA198

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