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INA129SHKQ Datasheet(PDF) 10 Page - Texas Instruments |
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INA129SHKQ Datasheet(HTML) 10 Page - Texas Instruments |
10 / 30 page 1000 10000 100000 1000000 110 120 130 140 150 160 170 180 190 200 210 Continuous TJ (°C) Electromigration Fail Mode Wirebond Failure Mode INA128-HT, INA129-HT SBOS501F – JANUARY 2010 – REVISED FEBRUARY 2015 www.ti.com (1) See the data sheet for absolute maximum and minimum recommended operating conditions. (2) The predicted operating lifetime vs. junction temperature is based on reliability modeling using electromigration as the dominant failure mechanism affecting device wearout for the specific device process and design characterisitics. (3) Wirebond lifetime is only applicable for D package. Figure 1. INA128HD, INA129SKGD1, and INA129SKGD2 Operating Life Derating Chart 10 Submit Documentation Feedback Copyright © 2010–2015, Texas Instruments Incorporated Product Folder Links: INA128-HT INA129-HT |
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