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INA129SJD Datasheet(PDF) 4 Page - Texas Instruments |
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INA129SJD Datasheet(HTML) 4 Page - Texas Instruments |
4 / 30 page NC V- IN V+ IN V- Ref V O V+ NC R G R G R G R G INA128-HT, INA129-HT SBOS501F – JANUARY 2010 – REVISED FEBRUARY 2015 www.ti.com Bond Pad Coordinates in Mils DESCRIPTION PAD NUMBER a b c d NC 1 –57.4 –31.1 –53.3 –27 V-IN 2 –9.85 –31.4 –5.75 –27.3 V+IN 3 25.05 –31.4 29.15 –27.3 V- 4 56.2 –34.3 60.3 –30.2 Ref 5 53.75 –17.6 57.85 –11 VO 6 50.35 27.8 56.95 31.9 V+ 7 7.75 30.2 11.85 34.3 NC 8 –57.4 28.4 –53.3 32.5 RG (1) 9 –57.4 13.4 –53.3 20 RG (1) 10 –57.5 2.7 –53.4 9.3 RG (1) 11 –57.5 –7.9 –53.4 –1.3 RG (1) 12 –57.4 –18.6 –53.3 –12 (1) Pads 9 and 10 must both be bonded to a common point and correspond to package pin 8. Pads 11 and 12 must both be bonded to a common point and correspond to package pin 1. 4 Submit Documentation Feedback Copyright © 2010–2015, Texas Instruments Incorporated Product Folder Links: INA128-HT INA129-HT |
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