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EFM32TG840F16-QFN64 Datasheet(PDF) 9 Page - Silicon Laboratories |
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EFM32TG840F16-QFN64 Datasheet(HTML) 9 Page - Silicon Laboratories |
9 / 70 page ...the world's most energy friendly microcontrollers 2015-03-06 - EFM32TG840FXX - d0011_Rev1.40 9 www.silabs.com 3 Electrical Characteristics 3.1 Test Conditions 3.1.1 Typical Values The typical data are based on TAMB=25°C and VDD=3.0 V, as defined in Table 3.2 (p. 9), by simu- lation and/or technology characterisation unless otherwise specified. 3.1.2 Minimum and Maximum Values The minimum and maximum values represent the worst conditions of ambient temperature, supply volt- age and frequencies, as defined in Table 3.2 (p. 9), by simulation and/or technology characterisa- tion unless otherwise specified. 3.2 Absolute Maximum Ratings The absolute maximum ratings are stress ratings, and functional operation under such conditions are not guaranteed. Stress beyond the limits specified in Table 3.1 (p. 9) may affect the device reliability or cause permanent damage to the device. Functional operating conditions are given in Table 3.2 (p. 9) . Table 3.1. Absolute Maximum Ratings Symbol Parameter Condition Min Typ Max Unit TSTG Storage tempera- ture range -40 150 1 °C TS Maximum soldering temperature Latest IPC/JEDEC J-STD-020 Standard 260 °C VDDMAX External main sup- ply voltage 0 3.8 V VIOPIN Voltage on any I/O pin -0.3 VDD+0.3 V 1Based on programmed devices tested for 10000 hours at 150°C. Storage temperature affects retention of preprogrammed cal- ibration values stored in flash. Please refer to the Flash section in the Electrical Characteristics for information on flash data re- tention for different temperatures. 3.3 General Operating Conditions 3.3.1 General Operating Conditions Table 3.2. General Operating Conditions Symbol Parameter Min Typ Max Unit TAMB Ambient temperature range -40 85 °C VDDOP Operating supply voltage 1.98 3.8 V fAPB Internal APB clock frequency 32 MHz fAHB Internal AHB clock frequency 32 MHz |
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