HBL5006 Series

http://onsemi.com

5

DEVICE ORDERING INFORMATION

Device

Marking

Package

HBL5006HT1G

HD

SOD−323

(Pb−Free)

3000 / Tape & Reel

SZHBL5006HT1G*

HD

HBL5006XV2T1G

56

SOD−523

(Pb−Free)

3000 / Tape & Reel

SZHBL5006XV2T1G*

56

HBL5006P2T5G

LD

SOD−923

(Pb−Free)

8000 / Tape & Reel

SZHBL5006P2T5G*

LD

†For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting

Techniques Reference Manual, SOLDERRM/D.

*SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP

Capable.

PACKAGE DIMENSIONS

SOD−323

CASE 477−02

ISSUE H

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. LEAD THICKNESS SPECIFIED PER L/F DRAWING

WITH SOLDER PLATING.

4. DIMENSIONS A AND B DO NOT INCLUDE MOLD

FLASH, PROTRUSIONS OR GATE BURRS.

5. DIMENSION L IS MEASURED FROM END OF RADIUS.

NOTE 3

D

1

2

b

E

A3

A1

A

C

NOTE 5

L

DIM

MIN

NOM

MAX

MILLIMETERS

A

0.80

0.90

1.00

A1

0.00

0.05

0.10

A3

0.15 REF

b

0.25

0.32

0.4

C

0.089

0.12

0.177

D

1.60

1.70

1.80

E

1.15

1.25

1.35

0.08

2.30

2.50

2.70

L

0.031

0.035

0.040

0.000

0.002

0.004

0.006 REF

0.010

0.012

0.016

0.003

0.005

0.007

0.062

0.066

0.070

0.045

0.049

0.053

0.003

0.090

0.098

0.105

MIN

NOM

MAX

INCHES

1.60

0.063

0.63

0.025

0.83

0.033

2.85

0.112

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*