LMX2486

SNAS324B – JANUARY 2006 – REVISED JANUARY 2016

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Power supply voltage

–0.3

4.25

V

Voltage on any pin with GND = 0 V

–0.3

V

Lead temperature (solder 4 sec.)

260

°C

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM)

±2000

Charged-device model (CDM)

±750

V

Machine model (MM)

±200

(1)

This is a high performance RF device is ESD-sensitive. Handling and assembly of this device should be done at an ESD free

workstation.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

2.5

3

3.6

V

Operating temperature

–40

25

85

°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate

conditions for which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications

and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. The voltage at

6.4 Thermal Information

LMX2486

RTW (WQFN)

UNIT

24 PINS

Junction-to-ambient thermal resistance

47.2

°C/W

Junction-to-case (top) thermal resistance

43

°C/W

Junction-to-board thermal resistance

24

°C/W

Junction-to-top characterization parameter

0.8

°C/W

Junction-to-board characterization parameter

24

°C/W

Junction-to-case (bottom) thermal resistance

7

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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