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LMX2486SQ Datasheet(PDF) 4 Page - Texas Instruments |
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LMX2486SQ Datasheet(HTML) 4 Page - Texas Instruments |
4 / 47 page LMX2486 SNAS324B – JANUARY 2006 – REVISED JANUARY 2016 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VCC Power supply voltage –0.3 4.25 V VI Voltage on any pin with GND = 0 V –0.3 VCC + 0.3 V TL Lead temperature (solder 4 sec.) 260 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6.2 ESD Ratings VALUE UNIT Human-body model (HBM) ±2000 V(ESD) Electrostatic discharge(1) Charged-device model (CDM) ±750 V Machine model (MM) ±200 (1) This is a high performance RF device is ESD-sensitive. Handling and assembly of this device should be done at an ESD free workstation. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VCC Power supply voltage (1) 2.5 3 3.6 V TA Operating temperature –40 25 85 °C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate conditions for which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. The voltage at all the power supply pins of VddRF1, VddRF2, VddRF3, VddRF4, VddRF5, VddIF1 and VddIF2 must be the same. VCC will be used to refer to the voltage at these pins and ICC will be used to refer to the sum of all currents through all these power pins. 6.4 Thermal Information LMX2486 THERMAL METRIC(1) RTW (WQFN) UNIT 24 PINS RθJA Junction-to-ambient thermal resistance 47.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 43 °C/W RθJB Junction-to-board thermal resistance 24 °C/W ψJT Junction-to-top characterization parameter 0.8 °C/W ψJB Junction-to-board characterization parameter 24 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 7 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: LMX2486 |
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