LMX2487

SNAS322C – FEBRUARY 2006 – REVISED JANUARY 2016

www.ti.com

Table of Contents

8.3

Feature Description................................................. 18

1

Features .................................................................. 1

8.4

Device Functional Modes........................................ 25

2

Applications ........................................................... 1

8.5

Programming .......................................................... 26

3

Description ............................................................. 1

8.6

Register Maps ........................................................ 28

4

Revision History..................................................... 2

9

Application and Implementation ........................ 39

5

Pin Configuration and Functions ......................... 3

9.1

Application Information............................................ 39

6

Specifications......................................................... 4

9.2

Typical Application ................................................. 40

6.1

Absolute Maximum Ratings ...................................... 4

10

Power Supply Recommendations ..................... 42

6.2

ESD Ratings.............................................................. 4

11

Layout................................................................... 42

6.3

Recommended Operating Conditions ....................... 4

11.1

Layout Guidelines ................................................. 42

6.4

Thermal Information .................................................. 4

11.2

Layout Example .................................................... 42

6.5

Electrical Characteristics........................................... 5

12

Device and Documentation Support ................. 43

6.6

Timing Requirements ................................................ 6

12.1

Community Resources.......................................... 43

6.7

Typical Characteristics .............................................. 7

12.2

Trademarks ........................................................... 43

7

Parameter Measurement Information ................ 13

12.3

Electrostatic Discharge Caution ............................ 43

7.1

Bench Test Set-Ups ................................................ 13

12.4

Glossary ................................................................ 43

8

Detailed Description ............................................ 18

13

Mechanical, Packaging, and Orderable

8.1

Overview ................................................................. 18

Information ........................................................... 43

8.2

Functional Block Diagram ....................................... 18

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision B (March 2013) to Revision C

Page

•

Added Pin Configuration and Functions section, Storage Conditions table, ESD Ratings table, Feature Description

section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations

section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable

Information section ................................................................................................................................................................ 1

Changes from Revision A (March 2013) to Revision B

Page

•

Changed layout of National Data Sheet to TI format ........................................................................................................... 38

2

Submit Documentation Feedback

Copyright © 2006–2016, Texas Instruments Incorporated

Product Folder Links: LMX2487