SN65LVDS104, SN65LVDS105

SLLS396G – SEPTEMBER 1999 – REVISED DECEMBER 2015

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

(2)

–0.5

4

V

Enables, A (SN65LVDS105)

–0.5

6

V

Voltage

A, B, Y or Z

–0.5

4

V

Continuous power dissipation

See Dissipation Ratings

Lead temperature 1.6 mm (1/16 inch) from case for 10 seconds

260

°C

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.

7.2 ESD Ratings—JEDEC

VALUE

UNIT

±12000

Electrostatic

V

discharge

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 ESD Ratings—MIL-STD

VALUE

UNIT

Class 3, A

16000

Tested in accordance with MIL-STD-883C Method

V

3015.7; A, B, Y, Z, and GND pins

Class 3, B

400

7.4 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

Supply voltage

3

3.3

3.6

V

High-level input voltage

2

V

Low-level input voltage

0.8

V

Voltage at any bus terminal (separately or common-mode)

0

Operating free-air temperature

–40

85

°C

7.5 Thermal Information

SN65LVDS104, SN65LVDS105

D (SOIC)

PW (TSSOP)

UNIT

16 PINS

16 PINS

Junction-to-ambient thermal resistance

74.4

101.6

°C/W

Junction-to-case (top) thermal resistance

35.1

29.2

°C/W

Junction-to-board thermal resistance

32

47.3

°C/W

Junction-to-top characterization parameter

6

1.4

°C/W

Junction-to-board characterization parameter

31.7

46.6

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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