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TRF3765IRHBT Datasheet(PDF) 5 Page - Texas Instruments |
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TRF3765IRHBT Datasheet(HTML) 5 Page - Texas Instruments |
5 / 52 page TRF3765 www.ti.com SLWS230E – SEPTEMBER 2011 – REVISED DECEMBER 2015 6 Specifications 6.1 Absolute Maximum Ratings Over operating free-air temperature range (unless otherwise noted). (1) MIN MAX UNIT All VCC pins except VCC_TK –0.3 3.6 Supply voltage (2) V VCC_TK –0.3 5.5 Digital I/O voltage –0.3 VI + 0.5 V Operating virtual junction temperature, TJ –40 150 °C Operating ambient temperature, TA –40 85 °C Storage temperature, Tstg –40 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground pin. 6.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1000 V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification JESD22- ±1500 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions Over operating free-air temperature range (unless otherwise noted). MIN NOM MAX UNIT VCC Power-supply voltage 3 3.3 3.6 V VCC_TK 3.3-V to 5.5-V power-supply voltage 3 3.3 5.5 V TA Operating ambient temperature –40 85 °C TJ Operating virtual junction temperature –40 150 °C 6.4 Thermal Information TRF3765 THERMAL METRIC(1) RHB (VQFN) UNIT 32 PINS RθJA Junction-to-ambient thermal resistance 31.6 °C/W RθJCtop Junction-to-case (top) thermal resistance 21.6 °C/W RθJB Junction-to-board thermal resistance 5.6 °C/W ψJT Junction-to-top characterization parameter 0.3 °C/W ψJB Junction-to-board characterization parameter 5.5 °C/W RθJCbot Junction-to-case (bottom) thermal resistance 1.1 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: TRF3765 |
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