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TRF3761-G Datasheet(PDF) 5 Page - Texas Instruments

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Part # TRF3761-G
Description  Integer-N PLL with Integrated VCO
Download  57 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TRF3761-G Datasheet(HTML) 5 Page - Texas Instruments

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TRF3761, TRF3761-A, TRF3761-B
TRF3761-C, TRF3761-D, TRF3761-E, TRF3761-F
TRF3761-G, TRF3761-H, TRF3761-J, TRF3761-K
www.ti.com
SLWS181K – OCTOBER 2005 – REVISED DECEMBER 2015
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Supply voltage range(2)
–0.3
5.5
V
Digital I/O voltage range
–0.3
VCC +0.3
V
TJ
Operating virtual junction temperature range
–40
150
°C
Tstg Storage temperature
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
(2)
All voltage values are with respect to network ground terminal.
7.2 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VCC
Power supply voltage
4.5
5
5.25
V
Power supply voltage ripple
940
μVpp
TA
Operating free air temperature range
–40
85
°C
TJ
Operating virtual junction temperature range
–40
150
°C
7.3 Thermal Information
TRF3761
THERMAL METRIC(1)
RHA (VQFN)
UNIT
40 PINS
Soldered slug, no airflow
26
°C/W
RθJA
Junction-to-ambient thermal resistance
Soldered slug, 200-LFM airflow
20.1
°C/W
Soldered slug, 400-LFM airflow
17.4
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
16.4
°C/W
RθJB
Junction-to-board thermal resistance
4.7
°C/W
ψJT
Junction-to-top characterization parameter
0.2
°C/W
ψJB
Junction-to-board characterization parameter
4.6
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
1
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
Copyright © 2005–2015, Texas Instruments Incorporated
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Product Folder Links: TRF3761 TRF3761-A TRF3761-B TRF3761-C TRF3761-D TRF3761-E TRF3761-F TRF3761-G
TRF3761-H TRF3761-J TRF3761-K


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