ADA4806-1 datasheet(8/24 Pages) AD

Part #	ADA4806-1

Description	0.2 關V/째C Offset Drift, 105 MHz, Low Power, Multimode, Rail-to-Rail Amplifier

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ADA4806-1

Data Sheet

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

Rating

Supply Voltage

11 V

Power Dissipation

See Figure 3

Common-Mode Input Voltage

−VS − 0.7 V to +VS + 0.7 V

Differential Input Voltage

±1 V

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +125°C

Lead Temperature (Soldering, 10 sec)

300°C

Junction Temperature

150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

θJA is specified for the worst case conditions, that is, θJA is specified

for a device soldered in a circuit board for surface-mount packages.

Table 6 lists the θJA for the ADA4806-1.

Table 6. Thermal Resistance

Package Type

θJA

Unit

8-Lead SOT-23

209.1

°C/W

MAXIMUM POWER DISSIPATION

The maximum safe power dissipation for the ADA4806-1 is

limited by the associated rise in junction temperature (TJ) on

the die. At approximately 150°C, which is the glass transition

temperature, the properties of the plastic change. Even temporarily

exceeding this temperature limit may change the stresses that the

package exerts on the die, permanently shifting the parametric

performance of the ADA4806-1. Exceeding a junction temperature

of 175°C for an extended period of time can result in changes in

silicon devices, potentially causing degradation or loss of

functionality.

The power dissipated in the package (PD) is the sum of the

quiescent power dissipation and the power dissipated in the die

due to the ADA4806-1 output load drive.

The quiescent power dissipation is the voltage between the supply

pins (VS) multiplied by the quiescent current (IS).

PD = Quiescent Power + (Total Drive Power − Load Power)

(

)

L

OUT

L

OUT

S

D

R

V

R

V

I

V

P

2

−













×

+

×

=

RMS output voltages must be considered. If RL is referenced

to −VS, as in single-supply operation, the total drive power is

VS × IOUT. If the rms signal levels are indeterminate, consider the

worst case, when VOUT = VS/4 for RL to midsupply.

(

) (

)

L

S

D

R

V

I

V

P

2

4

/

+

×

=

In single-supply operation with RL referenced to −VS, the worst

case is VOUT = VS/2.

Airflow increases heat dissipation, effectively reducing θJA.

Additionally, more metal directly in contact with the package

leads and exposed pad from metal traces, through holes,

ground, and power planes reduces θJA.

Figure 3 shows the maximum safe power dissipation in the

package vs. the ambient temperature on a JEDEC standard,

4-layer board. θJA values are approximations.

AMBIENT TEMPERATURE (°C)

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

–50

–30

–10

10

30

50

70

90

110

130

TJ = 150°C

Figure 3. Maximum Power Dissipation vs. Ambient Temperature for a

4-Layer Board

ESD CAUTION

Rev. 0 | Page 8 of 24

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