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LMX2541SQ2380E Datasheet(PDF) 6 Page - Texas Instruments |
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LMX2541SQ2380E Datasheet(HTML) 6 Page - Texas Instruments |
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6 / 70 page  LMX2541 SNOSB31J – JULY 2009 – REVISED DECEMBER 2014 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT Vcc Power Supply Voltage –0.3 3.6 V VIN Input Voltage to pins other than Vcc Pins –0.3 (Vcc + 0.3) V (3) TL Lead Temperature (solder 4 sec.) 260 °C Tstg Storage Temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. (3) Never to exceed 3.6 V. 7.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500 Charged-device model (CDM), per JEDEC specification JESD22- ±1750 V(ESD) Electrostatic discharge V C101(2) Machine model (MM) ±400 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions MIN NOM MAX UNIT Vcc Power Supply Voltage (All Vcc Pins) 3.15 3.3 3.45 V TA Ambient Temperature –40 85 °C 7.4 Thermal Information LMX2541 LMX2541 LMX2541 SQ2060E SQ2060E SQ2060E THERMAL METRIC(1) UNIT 9 Thermal 13 Thermal 16 Thermal Vias(2) Vias(3) Vias(4) RθJA Junction-to-ambient thermal resistance 31.7 30.3 29.8 °C/W ψJT Junction-to-top characterization parameter 7.3 7.3 7.3 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) Recommended for Most Reliable Solderability. (3) Compromise Between Solderability, Heat Dissipation, and Fractional Spurs. (4) Recommended for Optimal Heat Dissipation and Fractional Spurs. 6 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated Product Folder Links: LMX2541 |
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