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SL23EP09NZSC-1HT Datasheet(PDF) 10 Page - Silicon Laboratories |
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SL23EP09NZSC-1HT Datasheet(HTML) 10 Page - Silicon Laboratories |
10 / 11 page Rev 2.2, May 6, 2008 Page 10 of 11 SL23EP09NZ Package Outline and Package Dimensions 8 0.150(3.810) 0.157(3.987) 0.230(5.842) 0.244(6.197) 0.386(9.804) 0.393(9.982) 0.050(1.270) BSC 0.004(0.102) Seating plane 0.004(0.102) 0.0098(0.249) 0.061(1.549) 0.068(1.727) 0° to 8° 0.010(0.2540) 0.016(0.406) X 45° 0.016(0.406) 0.035(0.889) 0.0075(0.190) 0.0098(0.249) Pin-1 ID Dimensions are in inches (milimeters). Top line: (MIN) and Bottom line: (Max) 16-Lead SOIC (150-Mil) 1 9 16 0.0138(0.350) 0.0192(0.487) Thermal Characteristics Parameter Symbol Condition Min Typ Max Unit Thermal Resistance Junction to Ambient θ JA Still air - 78 - °C/W θ JA 1m/s air flow - 74 - °C/W θ JA 3m/s air flow - 70 - °C/W Thermal Resistance Junction to Case θ JC Independent of air flow - 44 - °C/W |
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