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ADS5401 Datasheet(PDF) 5 Page - Texas Instruments |
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ADS5401 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 49 page ADS5401 www.ti.com SLAS946B – APRIL 2013 – REVISED JANUARY 2016 Pin Functions (continued) PIN I/O DESCRIPTION NAME NO. GND I Ground IOVDD B10 I 1.8-V for digital I/Os 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT AVDD33 –0.5 4 AVDDC –0.5 2.3 AVDD18 –0.5 2.3 Supply voltage V DVDD –0.5 2.3 DVDDLVDS –0.5 2.3 IOVDD –0.5 4 INA_P, INA_N –0.5 AVDD33 + 0.5 V CLKINP, CLKINN –0.5 AVDDC + 0.5 V Voltage applied to input pins SYNCP, SYNCN –0.5 AVDD33 + 0.5 V SRESET, SDENB, SCLK, SDIO, SDO, ENABLE –0.5 IOVDD + 0.5 V Operating free-air temperature, TA –40 85 °C Operating junction temperature, TJ 150 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) 2000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) 750 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT SUPPLY AVDD33 3.15 3.3 3.45 Supply voltage AVDDC, AVDD18, DVDD, DVDDLVDS 1.7 1.8 1.9 V IOVDD 1.7 1.8 3.45 GENERAL PARAMETERS ADC Clock Frequency 40 800 MSPS Resolution 12 Bits TJ Recommended operating junction temperature 105 °C Maximum rated operating junction temperature(1) 125 TA Recommended free-air temperature –40 25 85 °C (1) Prolonged use at this junction temperature may increase the device failure-in-time (FIT) rate. Copyright © 2013–2016, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: ADS5401 |
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